Dubey, VikasVikasDubeyDerakhshandeh, JaberJaberDerakhshandehBeyne, EricEricBeyneGerets, CarineCarineGeretsCooper, E.E.CooperLaermans, PatrickPatrickLaermansDe Leersnijder, KoenKoenDe LeersnijderBaumans, KimKimBaumansRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerDe Wolf, IngridIngridDe Wolf2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26585Surface treatment to enable low temperature and pressure copper direct bondingProceedings paperhttp://ieeexplore.ieee.org/document/7545767/?arnumber=7545767