3D-SoC integration utilizing high accuracy wafer level bonding

Peng, LanLanPengKim, Soon-WookSoon-WookKimHeylen, NancyNancyHeylenReichardt, MaikMaikReichardtKurz, FlorianFlorianKurzWagenleitner, ThomasThomasWagenleitnerSleeckx, ErikErikSleeckxStruyf, HerbertHerbertStruyfRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/271293D-SoC integration utilizing high accuracy wafer level bondingProceedings paperhttp://ieeexplore.ieee.org/document/7861454/