Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Okoro, ChukwudiChukwudiOkoroVanstreels, KrisKrisVanstreelsLabie, RietRietLabieLuhn, OleOleLuhnVandevelde, BartBartVandeveldeVerlinden, BertBertVerlindenVandepitte, DirkDirkVandepitte2021-10-182021-10-1820100960-1317https://imec-publications.be/handle/20.500.12860/17730Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSVJournal article