Characterization of through-silicon vias using laser terahertz emission microscopy

Murakami, HironaruHironaruMurakamiMurakami, FumikazuFumikazuMurakamiSerita, KazunoriKazunoriSeritaTonouchi, MasayoshiMasayoshiTonouchiJacobs, KristofKristofJacobsBeyne, EricEricBeyne2022-03-042022-03-0420212520-1131WOS:000632468400007https://imec-publications.be/handle/20.500.12860/39308Characterization of through-silicon vias using laser terahertz emission microscopyJournal article10.1038/s41928-021-00559-zWOS:000632468400007RELIABILITY CHALLENGESPROPAGATION