Low cost wide temperature range adhesive flip-chip technology using a combination of ICA and NCA

Vanfleteren, JanJanVanfleterenVandecasteele, BjornBjornVandecasteelePodprocky, T.T.Podprocky2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6996Low cost wide temperature range adhesive flip-chip technology using a combination of ICA and NCAMeeting abstract