Oprins, HermanHermanOprinsCupak, MiroslavMiroslavCupakVan der Plas, GeertGeertVan der PlasVandevelde, BartBartVandeveldeMarchal, PolPolMarchalSrinivasan, AdiAdiSrinivasanCheng, EdmundEdmundCheng2021-10-182021-10-182009-10https://imec-publications.be/handle/20.500.12860/15947Fine grain thermal modeling of 3D stacked structuresProceedings paper