Creating 1 $lm RDL structures for fan-out wafer-level packaging

Flack, WarrenWarrenFlackSlabbekoorn, JohnJohnSlabbekoorn2021-10-252021-10-2520181526-1344https://imec-publications.be/handle/20.500.12860/30710Creating 1 $lm RDL structures for fan-out wafer-level packagingJournal articlehttp://www.chipscalereview.com/issue2018.html