Van Dyck, RikRikVan DyckBorgers, TomTomBorgersGovaerts, JonathanJonathanGovaertsNivelle, PhilippePhilippeNivellevan der Heide, ArvidArvidvan der HeideDe Jonge, S.S.De JongeVoroshazi, EszterEszterVoroshaziSzlufcik, JozefJozefSzlufcikVan Vuure, A.W.A.W.Van VuurePoortmans, JefJefPoortmans2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/32047Multi-wire interconnection: The impact of the lamination process and the encapsulant properties on the solder joint formationProceedings paperhttps://www.eupvsec-proceedings.com/proceedings?fulltext=imec&paper=45015