El-Mekki, ZaidZaidEl-MekkiPhilipsen, HaroldHaroldPhilipsenHonore, MiaMiaHonoreRadisic, AlexAlexRadisicSlabbekoorn, JohnJohnSlabbekoornStruyf, HerbertHerbertStruyfArnold, MarcoMarcoArnoldFluegel, AlexanderAlexanderFluegelMayer, DieterDieterMayerChang, Iris Shu-YaIris Shu-YaChang2026-10-292026-10-2920163067-9052https://imec-publications.be/handle/20.500.12860/60661<jats:title>ABSTRACT</jats:title> <jats:p>In this work, we demonstrate defect-free plating of Ø50 × 50 μm Cu pillars, on 300 mm wafers, for 3D stacking applications. We also demonstrate the capability to control and tune within-wafer (WIW) and within-die (WID) uniformity of Cu-pillar heights to given application requirements. Furthermore, by adjusting the concentration of plating additives, we are able to modify the shape and morphology of electroplated Cu pillars.</jats:p>enElectrodeposition of Ø50 × 50 μm Cu Pillars for 3D Stacking ApplicationsProceedings paper10.37665/warggyb20982