Sridhar, A.A.SridharCauwe, MaartenMaartenCauweFledderus, H.H.FledderusKusters, R.R.Kustersvan den Brand, JeroenJeroenvan den Brand2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21541Novel interconnect methodologies for ultra-thin chips on foilsProceedings paper