Multiple die-to-wafer adhesive bonding for heterogeneous integration

Keyvaninia, ShahramShahramKeyvaniniaMuneeb, MuhammadMuhammadMuneebStankovic, StevanStevanStankovicRoelkens, GuntherGuntherRoelkensVan Thourhout, DriesDriesVan ThourhoutFedeli, J.M.J.M.Fedeli2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20922Multiple die-to-wafer adhesive bonding for heterogeneous integrationProceedings paper