Phommahaxay, AlainAlainPhommahaxayJourdain, AnneAnneJourdainVerbinnen, GreetGreetVerbinnenWoitke, TobiasTobiasWoitkeStieber, RalfRalfStieberBisson, PeterPeterBissonGabriel, MarkusMarkusGabrielSpiess, WalterWalterSpiessGuerrero, AliceAliceGuerreroMcCutcheon, JeremyJeremyMcCutcheonPuligadda, RamaRamaPuligaddaBex, PieterPieterBexVan den Eede, AxelAxelVan den EedeSwinnen, BartBartSwinnenBeyer, GeraldGeraldBeyerMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/21303Process characterization of thin wafer debonding with thermoplastic materialsProceedings paper