Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper

Siau, SamSamSiauVervaet, A.A.VervaetVan Calster, AndreAndreVan CalsterSchacht, E.E.Schacht2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9590Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copperMeeting abstract