Deep Learning-Based High Throughput Inspection in 3D Nanofabrication and Defect Reversal in Nanopillar Arrays: Implications for Next Generation Transistors

Anand, UtkarshUtkarshAnandGhosh, TanmayTanmayGhoshAabdin, ZainulZainulAabdinVrancken, NandiNandiVranckenYan, HongweiHongweiYanXu, XiuMeiXiuMeiXuHolsteyns, FrankFrankHolsteynsMirsaidov, UtkurUtkurMirsaidov2023-08-072023-06-202023-08-0720212574-0970WOS:000635462900040https://imec-publications.be/handle/20.500.12860/42012Deep Learning-Based High Throughput Inspection in 3D Nanofabrication and Defect Reversal in Nanopillar Arrays: Implications for Next Generation TransistorsJournal article10.1021/acsanm.0c03283WOS:000635462900040SCANNING-ELECTRON-MICROSCOPYCAPILLARY RISEFABRICATIONWAFERPATTERNSTICTIONADHESIONMODEL