Residual thermomechanical stresses in thinned-chip assemblies

Leseduarte, S.S.LeseduarteMarco, S.S.MarcoBeyne, EricEricBeyneVan Hoof, RitaRitaVan HoofMarty, A.A.MartyPinel, S.S.PinelVendier, O.O.VendierCoello-Vera, A.A.Coello-Vera2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4526Residual thermomechanical stresses in thinned-chip assembliesJournal article