Protective layer for collective die to wafer hybrid bonding

Inoue, FumihiroFumihiroInoueBertheau, JulienJulienBertheauSuhard, SamuelSamuelSuhardPhommahaxay, AlainAlainPhommahaxayOhashi, TakuyaTakuyaOhashiKinoshita, TetsuroTetsuroKinoshitaKinoshita, YoheiYoheiKinoshitaBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33194Protective layer for collective die to wafer hybrid bondingProceedings paperhttps://ieeexplore.ieee.org/document/9058870