Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask

Siau, SamSamSiauDegrendele, LievenLievenDegrendeleDe Baets, JohanJohanDe BaetsVan Calster, AndreAndreVan Calster2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/8136Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder maskProceedings paper