Zang, S.S.ZangVereecken, M.M.VereeckenDe Baets, J.J.De BaetsVan Calster, AndreAndreVan CalsterVervaet, A.A.VervaetPeeters, JorisJorisPeetersAllaert, K.K.Allaert2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/2320Electroless nickel-gold stud bumping on laminate for flip-chip assemblyOral presentation