John, JoachimJoachimJohnZimmermann, LarsLarsZimmermannDe Moor, PietPietDe MoorDe Munck, KoenKoenDe MunckBorgers, TomTomBorgersVan Hoof, ChrisChrisVan Hoof2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9098High-density hybrid interconnect technologiesProceedings paper