Electro-thermal-mechanical analysis of a HQUAD package for high current and high power application

Chen, CarolineCarolineChenOprins, HermanHermanOprinsVandevelde, BartBartVandeveldeBrizar, GuyGuyBrizarVanderstraeten, DanielDanielVanderstraetenBlansaer, EddyEddyBlansaer2021-10-162021-10-162005-09https://imec-publications.be/handle/20.500.12860/10206Electro-thermal-mechanical analysis of a HQUAD package for high current and high power applicationProceedings paper