Electrochemical deposition seeding mechanisms of CuNi-alloys (for novel chip technologies)

Haesevoets, KarelKarelHaesevoetsVereecken, PhilippePhilippeVereeckenRadisic, AlexAlexRadisic2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26680Electrochemical deposition seeding mechanisms of CuNi-alloys (for novel chip technologies)Meeting abstract