Low damage cryogenic etching of porous organosilicate low-k materials using SF6/O2/SiF4

Zhang, LipingLipingZhangLjazouli, RamiRamiLjazouliLefaucheux, PhilippePhilippeLefaucheuxTillocher, ThomasThomasTillocherDussart, RemiRemiDussartMankelevich, YuriYuriMankelevichde Marneffe, Jean-FrancoisJean-Francoisde MarneffeDe Gendt, StefanStefanDe GendtBaklanov, MikhaïlMikhaïlBaklanov2021-10-212021-10-2120132162-8769https://imec-publications.be/handle/20.500.12860/23443Low damage cryogenic etching of porous organosilicate low-k materials using SF6/O2/SiF4Journal article