Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections

Zhang, WenqiWenqiZhangDimcic, BiljanaBiljanaDimcicLimaye, PareshPareshLimayeLa Manna, AntonioAntonioLa MannaSoussan, PhilippePhilippeSoussan2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/20210Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connectionsProceedings paper