Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions

Vandevelde, BartBartVandeveldeIvankovic, AndrejAndrejIvankovicDebecker, BjornBjornDebeckerLofrano, MelinaMelinaLofranoVanstreels, KrisKrisVanstreelsCherman, VladimirVladimirChermanGonzalez, MarioMarioGonzalezVan der Plas, GeertGeertVan der PlasDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyneTokei, ZsoltZsoltTokei2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/23289Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutionsMeeting abstract