"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects

De Vos, JoeriJoeriDe VosVan Huylenbroeck, StefaanStefaanVan HuylenbroeckJourdain, AnneAnneJourdainHeylen, NancyNancyHeylenPeng, LanLanPengJamieson, GeraldineGeraldineJamiesonTutunjyan, NinaNinaTutunjyanSardo, StefanoStefanoSardoMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30558"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnectsProceedings paperhttps://ieeexplore.ieee.org/document/8429741