Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture

Okoro, ChukwudiChukwudiOkoroEneman, GeertGeertEnemanGonzalez, MarioMarioGonzalezVandevelde, BartBartVandeveldeSwinnen, BartBartSwinnenStoukatch, SergueiSergueiStoukatchBeyne, EricEricBeyneVandepitte, DirkDirkVandepitte2021-10-162021-10-162007-05https://imec-publications.be/handle/20.500.12860/12637Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architectureProceedings paper