Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks

Beerten, StevenStevenBeertenLabie, RietRietLabieBeyne, EricEricBeyneVan Hoof, RitaRitaVan HoofHonoré, MiaMiaHonoré2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4106Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracksProceedings paper