Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish

Ratchev, PetarPetarRatchevVandevelde, BartBartVandeveldeDe Wolf, IngridIngridDe Wolf2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9497Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finishJournal article