Initial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structure

Kirimura, TomoyukiTomoyukiKirimuraCroes, KristofKristofCroesLi, YunlongYunlongLiDemuynck, StevenStevenDemuynckWilson, ChrisChrisWilsonLofrano, MelinaMelinaLofranoTokei, ZsoltZsoltTokei2021-10-202021-10-202012-04https://imec-publications.be/handle/20.500.12860/20940Initial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structureProceedings paper