Iker, FrancoisFrancoisIkerSoussan, PhilippePhilippeSoussanBeyne, EricEricBeyneBaert, KrisKrisBaert2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/13915Technology platform for 3-D stacking of thinned embedded diesProceedings paper