Electrodeposition for die-to-wafer very high-density interconnect

Inoue, FumihiroFumihiroInoue2021-10-282021-10-282020https://imec-publications.be/handle/20.500.12860/35305Electrodeposition for die-to-wafer very high-density interconnectMeeting abstracthttps://iopscience.iop.org/article/10.1149/MA2020-02251786mtgabs