Multilayer thin film technology as an enabling technology for System-in-Package (SIP) and "above-IC" Processing

Beyne, EricEricBeyne2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7206Multilayer thin film technology as an enabling technology for System-in-Package (SIP) and "above-IC" ProcessingOral presentation