Vandevelde, BartBartVandeveldeGonzalez, MarioMarioGonzalezBeyne, EricEricBeyneVandepitte, D.D.VandepitteBaelmans, M.M.Baelmans2021-10-152021-10-152004https://imec-publications.be/handle/20.500.12860/9829Influence of printed circuit board properties on solder joint fatigue life of assembled IC packagesProceedings paper