Wojciechowski, DominiqueDominiqueWojciechowskiVanfleteren, JanJanVanfleterenReese, E.E.ReeseHagedorn, H.H.Hagedorn2021-10-012021-10-011998https://imec-publications.be/handle/20.500.12860/3160New adhesives for high density flip-chip interconnectionsProceedings paper