Substantial Dose Reduction Using Dry Deposited Underlayer for EUV Lithography While Maintaining Roughness and Minimizing Defects

Kundu, AchintyaAchintyaKunduGupta, MihirMihirGuptaDe Simone, DaniloDaniloDe SimoneVanelderen, PieterPieterVanelderenSuh, Hyo SeonHyo SeonSuhDe Roest, DavidDavidDe RoestChristy, DennisDennisChristyDavodi, FatemehFatemehDavodiPatel, KishanKishanPatelWallace, SteaphanSteaphanWallaceSun, YitingYitingSunTomczak, YoannYoannTomczak2025-06-172025-05-112025-06-172024978-1-5106-8155-20277-786XWOS:001467876500021https://imec-publications.be/handle/20.500.12860/45645Substantial Dose Reduction Using Dry Deposited Underlayer for EUV Lithography While Maintaining Roughness and Minimizing DefectsProceedings paper10.1117/12.3034575978-1-5106-8156-9WOS:001467876500021