High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages

Priyabadini, SwarnakamalSwarnakamalPriyabadiniSterken, TomTomSterkenCauwe, MaartenMaartenCauweVan Hoorebeke, LucLucVan HoorebekeVanfleteren, JanJanVanfleteren2021-10-222021-10-2220142156-3950https://imec-publications.be/handle/20.500.12860/24398High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packagesJournal articlehttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6657822