Fast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICs

Maggioni, FedericaFedericaMaggioniOprins, HermanHermanOprinsBeyne, EricEricBeyneDe Wolf, IngridIngridDe WolfBaelmans, MartineMartineBaelmans2021-10-232021-10-2320162156-3950https://imec-publications.be/handle/20.500.12860/26940Fast transient convolution-based thermal modeling methodology for including the package thermal impact in 3D-ICsJournal articlehttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7406758