Photonics-CMOS 3D integration: copper through-silicon-via approach

Masood, AdilAdilMasoodBogaerts, WimWimBogaertsVan Olmen, JanJanVan OlmenVan Aelst, JokeJokeVan AelstVan Thourhout, DriesDriesVan ThourhoutSabuncuoglu Tezcan, DenizDenizSabuncuoglu Tezcan2021-10-182021-10-182009https://imec-publications.be/handle/20.500.12860/15841Photonics-CMOS 3D integration: copper through-silicon-via approachProceedings paper