Challenges for smoothing EUV photoresist line-width-roughness: plasma treatment from 40 to 22 nm half pitches

Altamirano Sanchez, EfrainEfrainAltamirano SanchezDe Schepper, PeterPeterDe SchepperHansen, TerjeTerjeHansenBoullart, WernerWernerBoullart2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/21967Challenges for smoothing EUV photoresist line-width-roughness: plasma treatment from 40 to 22 nm half pitchesOral presentation