De Vos, JoeriJoeriDe VosJourdain, AnneAnneJourdainErismis, Mehmet AkifMehmet AkifErismisZhang, WenqiWenqiZhangDe Munck, KoenKoenDe MunckLa Manna, AntonioAntonioLa MannaSabuncuoglu Tezcan, DenizDenizSabuncuoglu TezcanSoussan, PhilippePhilippeSoussan2021-10-192021-10-192011https://imec-publications.be/handle/20.500.12860/18808High density 20μm pitch CuSn microbump process for high-end 3D applicationsProceedings paper