De Preter, IngeIngeDe PreterDerakhshandeh, JaberJaberDerakhshandehBex, PieterPieterBexFodor, FerencFerencFodorCherman, VladimirVladimirChermanRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28149Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatingsProceedings paperhttp://ieeexplore.ieee.org/document/8309263/