Packaging solution with a 3-dimensional alignment approach for 2-dimensional parallel direct optical interconnects to the chip

Rits, OlivierOlivierRitsBockstaele, R.R.BockstaeleNaessens, KrisKrisNaessensBaets, RoelRoelBaets2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/11106Packaging solution with a 3-dimensional alignment approach for 2-dimensional parallel direct optical interconnects to the chipProceedings paper