Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Xu, PengfeiPengfeiXuHe, JunwenJunwenHeKennes, KoenKoenKennesDvoretskii, AntonAntonDvoretskiiPodpod, ArnitaArnitaPodpodLepage, GuyGuyLepageGolshani, NeginNeginGolshaniMagdziak, RafalRafalMagdziakBipul, SwetanshuSwetanshuBipulBode, DieterDieterBodeVerheyen, PeterPeterVerheyenChakrabarti, MaumitaMaumitaChakrabartiVelenis, DimitriosDimitriosVelenisMiller, AndyAndyMillerBan, YoojinYoojinBanFerraro, FilippoFilippoFerraroVan Campenhout, JorisJorisVan Campenhout2025-04-172024-10-172025-04-172024979-8-3503-7758-3N/AWOS:001242671400322https://imec-publications.be/handle/20.500.12860/44652Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-WaferProceedings paper10.1364/OFC.2024.Tu3A.4WOS:001242671400322