Duval, FabriceFabriceDuvalOkoro, ChukwudiChukwudiOkoroCivale, YannYannCivaleSoussan, PhilippePhilippeSoussanBeyne, EricEricBeyne2021-10-192021-10-1920111521-3331https://imec-publications.be/handle/20.500.12860/18861Polymer filling of silicon trenches for 3D through silicon vias applicationsJournal article