Hu, Yu-HsiangYu-HsiangHuLiu, C.S.C.S.LiuChen, M.T.M.T.ChenCheng, M.D.M.D.ChengKuo, H.J.H.J.KuoLii, M.J.M.J.LiiLa Manna, AntonioAntonioLa MannaRebibis, Kenneth JuneKenneth JuneRebibisWang, TengTengWangDaily, RobertRobertDailyCapuz, GiovanniGiovanniCapuzVelenis, DimitriosDimitriosVelenisBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneYu, Doug C.H.Doug C.H.Yu2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23966Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyondProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6897342&contentType=Conference+Publications