RF modelling and characterization of TSVs and inductive links of hybrid bonded devices

Sun, XiaoXiaoSunSu, Chin-YaChin-YaSuChen, Shih-HungShih-HungChenChew, Soon AikSoon AikChewZhang, BoyaoBoyaoZhangBeyne, EricEricBeyne2025-04-102024-12-072025-04-102024979-8-3503-7599-20569-5503WOS:001260983500122https://imec-publications.be/handle/20.500.12860/44935RF modelling and characterization of TSVs and inductive links of hybrid bonded devicesProceedings paper10.1109/ECTC51529.2024.00123979-8-3503-7598-5WOS:001260983500122