Scale Up Of Advanced Packaging And System Integration For Hybrid Technologies

Selim, RamseyRamseySelimHoofman, RomanoRomanoHoofmanLabie, RietRietLabieSandeep, VedaVedaSandeepDrischel, ThomasThomasDrischelTorki, KholdounKholdounTorki2023-01-172022-10-292022-11-212023-01-172021-07-02NAWOS:000849966100023https://imec-publications.be/handle/20.500.12860/40636Scale Up Of Advanced Packaging And System Integration For Hybrid TechnologiesProceedings paper10.1109/SSI52265.2021.9467004978-1-6654-4092-9WOS:000849966100023Electrical & electronic engineering