20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Ji, XinruiXinruiJiDu, LeimingLeimingDuvan Zeijl, HenkHenkvan ZeijlZhang, GuoqiGuoqiZhangDerakhshandeh, JaberJaberDerakhshandehBeyne, EricEricBeyne2025-04-102024-12-072025-04-102024979-8-3503-7599-20569-5503WOS:001260983500311https://imec-publications.be/handle/20.500.12860/4495220 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sinteringProceedings paper10.1109/ECTC51529.2024.00221979-8-3503-7598-5WOS:001260983500311