Bender, HugoHugoBenderDrijbooms, ChrisChrisDrijboomsVan Marcke, PatriciaPatriciaVan MarckeGeypen, JefJefGeypenPhilipsen, HaroldHaroldPhilipsenRadisic, AlexAlexRadisic2021-10-202021-10-2020120022-2461https://imec-publications.be/handle/20.500.12860/20353Structural characterization of through silicon vias (TSV)Journal article10.1007/s10853-010-5144-6