Yang, YuYuYangLabie, RietRietLabieRichard, OlivierOlivierRichardBender, HugoHugoBenderZhao, ChaoChaoZhaoVerlinden, BertBertVerlindenDe Wolf, IngridIngridDe Wolf2021-10-192021-10-1920101099-0062https://imec-publications.be/handle/20.500.12860/18382The impact of back-side Cu contamination on 3D stacking architectureJournal article